Global Advanced Packaging Market Analysis Report 2019 – Segment, Top Players, Trends till 2024

The Global Advanced Packaging Market Growth 2019-2024 Report added by DecisionDatabases.com gives an in depth industry analysis of the market. It covers the costing, sales, revenue details and forecasts.

During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit board. Typical packaging configurations have included the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and package-on package setups of the 2000s, and, most recently, 2-D integrated-circuit technologies such as wafer-level, flip-chip, and through silicon via setups.

The commercial reality for most integrated-circuit (IC) manufacturers is that node migrations and changes in wafer sizes are slowing down even as capital expenditures are increasing. One way for manufacturers to preserve their edge on their circuits’ small sizes, low costs, and high performance is to incorporate newer chip-packaging options such as 2.5-D integrated circuits (2.5DICs) and 3-D integrated circuits (3.0DICs) into their production processes. These advanced-packaging technologies, many of which are still in their infancy, promise greater chip connectivity and lower power consumption compared with traditional packaging configurations.

According to this study, over the next five years the Advanced Packaging market will register a xx% CAGR in terms of revenue, the global market size will reach US$ xx million by 2024, from US$ xx million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Advanced Packaging business, shared in Chapter 3.

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The key manufacturers covered in this report:

·         ASE

·         Amkor

·         SPIL

·         Stats Chippac

·         PTI

·         JCET

·         J-Devices

·         UTAC

·         Chipmos

·         Chipbond

·         STS

·         Huatian

·         NFM

·         Carsem

·         Walton

·         Unisem

·         OSE

·         AOI

·         Formosa

·         NEPES

Segmentation by product type:

·         3.0 DIC

·         FO SIP

·         FO WLP

·         3D WLP

·         WLCSP

·         2.5D

·         Filp Chip

  

Segmentation by application:

·         Automotives

·         Computers

·         Communications

·         LED

·         Healthcare

·         Other

This report also splits the market by region:

·         Americas

·          United States

·          Canada

·          Mexico

·          Brazil

·          APAC

·          China

·         Japan

·         …….

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Research objectives

·         To study and analyze the global Advanced Packaging consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.

·         To understand the structure of Advanced Packaging market by identifying its various subsegments.

·         Focuses on the key global Advanced Packaging manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.

·         To analyze the Advanced Packaging with respect to individual growth trends, future prospects, and their contribution to the total market.

·         To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).

·         To project the consumption of Advanced Packaging submarkets, with respect to key regions (along with their respective key countries).

·         To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

·         To strategically profile the key players and comprehensively analyze their growth strategies.

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